Mechanical Issues Induced by Electrical Wafer Sort: Correlations from actual tests, Nanoindentation and 3D Dynamic Modeling

Romuald Roucou (1, 2) , Vincent Fiori (2) , Karim Inal (1) , Hervé Jaouen (2)

1 PS2-ENSMSE - Département Packaging et Supports Souples
2 ST-CROLLES - STMicroelectronics [Crolles]

Domaines: Mécanique des matériaux [physics.class-ph]; Mécanique des matériaux [physics.class-ph]; Micro et nanotechnologies/Microélectronique

Romuald Roucou, Vincent Fiori, Karim Inal, Hervé Jaouen. Mechanical Issues Induced by Electrical Wafer Sort: Correlations from actual tests, Nanoindentation and 3D Dynamic Modeling. Electronics System Integration Technology Conference ESTC 2010, Sep 2010, Berlin, Germany. pp.P0027, ⟨10.1109/ESTC.2010.5642863⟩. ⟨emse-00533813⟩